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Specifications
Thermal Conductance - >350,000W/m2 °C (0.001 inch layer)
Thermal Resistance - <0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size - <0.49 microns <0.000020 inch
Extended Temperature Limits - Peak: -50°C to >180°C Long-Term: -50°C to 130°C
Performance - 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode embedded in the CPU core.
Coverage Area - 3.5 gram tube contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram tube will cover approximately 16 square inches.
Thermal Conductance - >350,000W/m2 °C (0.001 inch layer)
Thermal Resistance - <0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size - <0.49 microns <0.000020 inch
Extended Temperature Limits - Peak: -50°C to >180°C Long-Term: -50°C to 130°C
Performance - 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode embedded in the CPU core.
Coverage Area - 3.5 gram tube contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram tube will cover approximately 16 square inches.
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